Effect of material interactions during thermal shock testing on IC package reliability

When large devices are molded in plastic, typically a low-stress epoxy compound is used together with a polyimide stress-relief coating. However, the interaction of these two materials, along with the die attach, is not well understood. Adverse interfacial effects on the plastic-encapsulated devices...

Full description

Saved in:
Bibliographic Details
Main Authors: Chen, A.S., Nguyen, L.T., Gee, S.A.
Format: Conference Proceeding
Language:English
Subjects:
Coatings
Electric shock
Integrated circuit packaging
Integrated circuit testing
Materials reliability
Materials testing
Microassembly
Polyimides
Semiconductor device packaging
Thermal stresses
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:When large devices are molded in plastic, typically a low-stress epoxy compound is used together with a polyimide stress-relief coating. However, the interaction of these two materials, along with the die attach, is not well understood. Adverse interfacial effects on the plastic-encapsulated devices can occur with the selection of the wrong combination of materials. With increasing die size, reliability becomes an important concern. Using the optimum combination of materials should provide the longest-lived packages. However, that combination is not known at this time. This study attempts at elucidating the interaction of three main material components in a plastic package: mold compound, die attach, and die coating.< >
DOI:10.1109/ECTC.1993.346774