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Microchannel heat sinks for two-dimensional high-power-density diode laser arrays

The operation of a two-dimensional GaInAsP/InP diode laser array with CW power dissipation up to 500 W/cm/sup 2/ into a Si microchannel heat sink is discussed. The approximately 1*4-mm/sup 2/ laser array was used to characterize the heat sink, and the value of 0.040 degrees C cm/sup 2//W was obtaine...

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Bibliographic Details
Published in:IEEE journal of quantum electronics 1989-09, Vol.25 (9), p.1988-1992
Main Authors: Missaggia, L.J., Walpole, J.N., Liau, Z.L., Phillips, R.J.
Format: Article
Language:English
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Summary:The operation of a two-dimensional GaInAsP/InP diode laser array with CW power dissipation up to 500 W/cm/sup 2/ into a Si microchannel heat sink is discussed. The approximately 1*4-mm/sup 2/ laser array was used to characterize the heat sink, and the value of 0.040 degrees C cm/sup 2//W was obtained for the thermal resistance per unit area. The extrapolated value for a 1-cm/sup 2/ heated area is 0.070 degrees C cm/sup 2//W.< >
ISSN:0018-9197
1558-1713
DOI:10.1109/3.35223