A New Chip and a New Package for Higher Power

The best of the state of the art in power handling with integrated circuits can be reached only if innova tions are introduced to both the chip and the package designs.

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Bibliographic Details
Published in:IEEE transactions on consumer electronics 1980-02, Vol.CE-26 (1), p.54-72
Main Authors: Cini, Carlo, Palara, Sergio, Seragnoli, Giordano
Format: Article
Language:English
Subjects:
Bridge circuits
Chip scale packaging
Cost function
Electronics packaging
Flexible printed circuits
Integrated circuit packaging
Integrated circuit reliability
Power amplifiers
Production
Thermal resistance
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Description
Summary:The best of the state of the art in power handling with integrated circuits can be reached only if innova tions are introduced to both the chip and the package designs.
ISSN:0098-3063
1558-4127
DOI:10.1109/TCE.1980.273320