Molengineered material solutions for today's opportunities in photonic-microelectronic integration

Molecularly engineered materials provide a bridge for monolithic active and passive photonic-microelectronic integration. This paper updates work on molengineered materials that span material and process gaps across conventional techniques from CMOS microelectronics to polymer photonics

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Bibliographic Details
Main Author: Kubacki, R.M.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
CMOS process
Fabrication
Foundries
Manufacturing processes
Microelectronics
Optical interconnections
Optical materials
Photonics
Silicon
Online Access:Request full text
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Description
Summary:Molecularly engineered materials provide a bridge for monolithic active and passive photonic-microelectronic integration. This paper updates work on molengineered materials that span material and process gaps across conventional techniques from CMOS microelectronics to polymer photonics
ISSN:1092-8081
2766-1733
DOI:10.1109/LEOS.2006.278755