Multi Function and High Power Amplifier Chipset for X-Band Phased Array Frontends

This paper presents the design and measurement results of two MMICs for X-band phased array applications: a multi function chip (MFC) and high power amplifier (HPA). The fully integrated MFC combines the phase and attenuation setting, transmit/receive (T/R) switching, low noise amplifier and driver...

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Bibliographic Details
Main Authors: van Heijningen, M., de Boer, A., Hoogland, J.A., van Wanum, M., de Hek, A.P., van Vliet, F.E., Brouzes, H.
Format: Conference Proceeding
Language:English
Subjects:
Attenuation
Driver circuits
high power amplifier
High power amplifiers
Low-noise amplifiers
MMIC
MMICs
Phase measurement
Phase noise
Phased array
Phased arrays
Power measurement
radar
Semiconductor device measurement
transmit/receive module
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Summary:This paper presents the design and measurement results of two MMICs for X-band phased array applications: a multi function chip (MFC) and high power amplifier (HPA). The fully integrated MFC combines the phase and attenuation setting, transmit/receive (T/R) switching, low noise amplifier and driver amplifier. Furthermore active biasing and a low-voltage CMOS compatible digital interface are included. The HPA design is matched to the MFC to create a two-chip T/R module solution and shows an excellent performance of 39.7 dBm output power with 46 % PAE at 9.0 GHz
DOI:10.1109/EMICC.2006.282796