Foreword Special Section on Drop Testing

The six papers in this special section focus on drop testing. The papers are briefly summarized here.

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2007-01, Vol.30 (1), p.41-41
Main Author: Nguyen, Luu T.
Format: Article
Language:English
Subjects:
Assembly
Cellular phones
Electronic equipment testing
Electronics packaging
Employee welfare
Industrial training
Semiconductor device modeling
Semiconductor device packaging
Thermal management
Wafer scale integration
Online Access:Get full text
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Description
Summary:The six papers in this special section focus on drop testing. The papers are briefly summarized here.
ISSN:1521-334X
1558-0822
DOI:10.1109/TEPM.2007.893269