A WLAN/WMAN Dual Mode Transceiver System for Indoor/Outdoor Application

WLAN (IEEE 802.11a)/VMAN (IEEE 802.16a) dual mode transceiver chip has been proposed, designed and fabricated. Transceiver RF IC chip with packaged size of 6 mm*6 mm was fabricated using 0.25 um SiGe BiCMOS process. Power amplifier and PLL/VCO chip were fabricated using the same process. Ceramic fro...

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Bibliographic Details
Main Authors: Kukjin Chun, Joonyeop Lee, Ji-Hyuk Kim, Hyeon Cheol Kim, Kwang-Jun Yoon, Young-Ill Kim, In-Sang Song
Format: Conference Proceeding
Language:English
Subjects:
BiCMOS integrated circuits
Germanium silicon alloys
Integrated circuit packaging
Power amplifiers
Radio frequency
Radiofrequency amplifiers
Radiofrequency integrated circuits
Silicon germanium
Transceivers
Wireless LAN
Online Access:Request full text
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Description
Summary:WLAN (IEEE 802.11a)/VMAN (IEEE 802.16a) dual mode transceiver chip has been proposed, designed and fabricated. Transceiver RF IC chip with packaged size of 6 mm*6 mm was fabricated using 0.25 um SiGe BiCMOS process. Power amplifier and PLL/VCO chip were fabricated using the same process. Ceramic front-end filter were also fabricated for WLAN/WMAN frequencies. To make compact transceiver system, these chips was mounted on 2 cm*2 cm double side PCB. The full system has been tested with external ADC/DAC and baseband modem. The measured results show that fabricated transceiver system meets the requirements for WLAN/WMAN standards
DOI:10.1109/ISWPC.2007.342592