RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module

Aeroflex Colorado Springs has developed a 16 Mbit multi-chip module (MCM) SRAM operating on a single 5 V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print confi...

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Bibliographic Details
Main Authors: Hafer, C., Mabra, J., Slocum, D., Thorne, S.
Format: Conference Proceeding
Language:English
Subjects:
Aluminum
Assembly
Bonding
Packaging
Plasma applications
Power supplies
Random access memory
Springs
Stacking
Wire
Online Access:Request full text
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Description
Summary:Aeroflex Colorado Springs has developed a 16 Mbit multi-chip module (MCM) SRAM operating on a single 5 V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print configuration. Conventional aluminum wire bonding has been used to optimize the reliability of this packaging technique.
ISSN:1095-323X
2996-2358
DOI:10.1109/AERO.2007.353101