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RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module
Aeroflex Colorado Springs has developed a 16 Mbit multi-chip module (MCM) SRAM operating on a single 5 V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print confi...
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| creator | Hafer, C. Mabra, J. Slocum, D. Thorne, S. |
| description | Aeroflex Colorado Springs has developed a 16 Mbit multi-chip module (MCM) SRAM operating on a single 5 V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print configuration. Conventional aluminum wire bonding has been used to optimize the reliability of this packaging technique. |
| doi_str_mv | 10.1109/AERO.2007.353101 |
| format | conference_proceeding |
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Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print configuration. Conventional aluminum wire bonding has been used to optimize the reliability of this packaging technique.</description><subject>Aluminum</subject><subject>Assembly</subject><subject>Bonding</subject><subject>Packaging</subject><subject>Plasma applications</subject><subject>Power supplies</subject><subject>Random access memory</subject><subject>Springs</subject><subject>Stacking</subject><subject>Wire</subject><issn>1095-323X</issn><issn>2996-2358</issn><isbn>1424405246</isbn><isbn>9781424405244</isbn><isbn>1424405254</isbn><isbn>9781424405251</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNpFj0tLw0AURscXmFb3gpv5A4n3ziuTZUyrFRoqtQt3ZSa5o6OxljQV_PcWFFx9i8M58DF2hZAhQnFTTpeLTADkmdQSAY_YCJVQCrTQ6pgloihMKqS2J_9AmVOWHGSdSiGfz9lot3sDECAsJOx26dqZ61uOpvZx4E_LsuaPrnl3L9TyuOGOV24zxI6-qOeTSLzed0NMq9e45fVnu-_ogp0F1-3o8m_HbHU3XVWzdL64f6jKeRoLGNKcFHivnbU6BPLBF6ApJ1KNka4JoXUGqEHT5EjSHh5ak0uv0Te5boOVcsyuf7ORiNbbPn64_nut0KBGlD9z40un</recordid><startdate>200703</startdate><enddate>200703</enddate><creator>Hafer, C.</creator><creator>Mabra, J.</creator><creator>Slocum, D.</creator><creator>Thorne, S.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200703</creationdate><title>RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module</title><author>Hafer, C. ; Mabra, J. ; Slocum, D. ; Thorne, S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-7e40bb5a885ffebfb905e7ee4c63acffda60ec16c71e380078673b51bc75df833</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Aluminum</topic><topic>Assembly</topic><topic>Bonding</topic><topic>Packaging</topic><topic>Plasma applications</topic><topic>Power supplies</topic><topic>Random access memory</topic><topic>Springs</topic><topic>Stacking</topic><topic>Wire</topic><toplevel>online_resources</toplevel><creatorcontrib>Hafer, C.</creatorcontrib><creatorcontrib>Mabra, J.</creatorcontrib><creatorcontrib>Slocum, D.</creatorcontrib><creatorcontrib>Thorne, S.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hafer, C.</au><au>Mabra, J.</au><au>Slocum, D.</au><au>Thorne, S.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module</atitle><btitle>2007 IEEE Aerospace Conference</btitle><stitle>AERO</stitle><date>2007-03</date><risdate>2007</risdate><spage>1</spage><epage>5</epage><pages>1-5</pages><issn>1095-323X</issn><eissn>2996-2358</eissn><isbn>1424405246</isbn><isbn>9781424405244</isbn><eisbn>1424405254</eisbn><eisbn>9781424405251</eisbn><abstract>Aeroflex Colorado Springs has developed a 16 Mbit multi-chip module (MCM) SRAM operating on a single 5 V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print configuration. Conventional aluminum wire bonding has been used to optimize the reliability of this packaging technique.</abstract><pub>IEEE</pub><doi>10.1109/AERO.2007.353101</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1095-323X |
| ispartof | 2007 IEEE Aerospace Conference, 2007, p.1-5 |
| issn | 1095-323X 2996-2358 |
| language | eng |
| recordid | cdi_ieee_primary_4161511 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aluminum Assembly Bonding Packaging Plasma applications Power supplies Random access memory Springs Stacking Wire |
| title | RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module |
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