BIST Method for Die-Level Process Parameter Variation Monitoring in Analog/Mixed-Signal Integrated Circuits

This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-level process monitoring. The objective of this test is not to replace traditional specification-based tests, but to provide a reliable method for early identification of excessive process parameter v...

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Bibliographic Details
Main Authors: Zjajo, A., Barragan Asian, M.J., de Gyvez, J.P.
Format: Conference Proceeding
Language:English
Subjects:
Automatic testing
Built-in self-test
Circuit testing
Condition monitoring
Design for testability
Logic testing
Mixed analog digital integrated circuits
Observability
Performance evaluation
Sequential analysis
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Summary:This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-level process monitoring. The objective of this test is not to replace traditional specification-based tests, but to provide a reliable method for early identification of excessive process parameter variations in production tests that allows quickly discarding of the faulty circuits. Additionally, the possibility of on-chip process deviation monitoring provides valuable information, which is used to guide the test and to allow the estimation of selected performance figures. The information obtained through guiding and monitoring process variations is re-used and supplement the circuit calibration
ISSN:1530-1591
1558-1101
DOI:10.1109/DATE.2007.364477