Inductor Design Optimization for RFIC Application

This paper investigates an electromigration (EM) hardened design optimization for integrated circuit inductors. Inductor layouts that utilize a metal reservoir and a stack via/metal have improved EM performance and heat dissipation. The improvement can be converted to inductor scaling and RFIC die s...

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Bibliographic Details
Main Authors: Yung-Huei Lee, Yin-Lung Ryan Lu, McMahon, W.
Format: Conference Proceeding
Language:English
Subjects:
Computer simulation
Design optimization
Electromigration
Gain measurement
Inductors
Integrated circuit measurements
Power measurement
Radiofrequency integrated circuits
Reservoirs
Robustness
Online Access:Request full text
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Description
Summary:This paper investigates an electromigration (EM) hardened design optimization for integrated circuit inductors. Inductor layouts that utilize a metal reservoir and a stack via/metal have improved EM performance and heat dissipation. The improvement can be converted to inductor scaling and RFIC die size reduction. High-frequency measurements indicate that the new inductor layout design does not affect the inductor-Q and circuit power gain. Computer simulation farther validates the robust performance of the scaled inductor and the RFIC circuits.
ISSN:1524-766X
2690-8174
DOI:10.1109/VTSA.2007.378946