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An MILP Approach to Wafer Sampling and Selection

This paper introduces a novel algorithm for selecting the optimal wafers for measurement given a set of selection rules. The algorithm is based on assigning a penalty to each of the sampling rules and then using a mixed-integer linear program to pick the wafers which minimize the sum of the penaltie...

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Published in:IEEE transactions on semiconductor manufacturing 2007-11, Vol.20 (4), p.400-407
Main Authors: Good, R.P., Purdy, M.A.
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Language:English
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description This paper introduces a novel algorithm for selecting the optimal wafers for measurement given a set of selection rules. The algorithm is based on assigning a penalty to each of the sampling rules and then using a mixed-integer linear program to pick the wafers which minimize the sum of the penalties. By waiting until the metrology step to determine the best wafers to measure, a real-time decision can be made based on which wafers have previously been measured, the tools and chambers on which wafers were processed, and other user-specified selection criteria. The penalties can also be increased after a rule violation to ensure that each of the selection rules are satisfied at a finite frequency.
doi_str_mv 10.1109/TSM.2007.907616
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identifier ISSN: 0894-6507
ispartof IEEE transactions on semiconductor manufacturing, 2007-11, Vol.20 (4), p.400-407
issn 0894-6507
1558-2345
language eng
recordid cdi_ieee_primary_4369337
source IEEE Xplore (Online service)
subjects Adaptive sampling
Algorithms
Applied sciences
Chambers
Electronics
Exact sciences and technology
Frequency
History
Mathematical analysis
Metrology
Microelectronic fabrication (materials and surfaces technology)
mixed-integer programming
Monitoring
Optimization
Process control
Production facilities
Sampling
Sampling methods
Semiconductor device manufacture
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Semiconductors
wafer sampling
wafer-level control
Wafers
title An MILP Approach to Wafer Sampling and Selection
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