Conception and test of flat heat pipe for 3D packaging cooling

This paper presents the conception and the experimental investigation on flat heat pipe with sintered powder wick structure and very thin wails. The heat pipe is integrated in the substrate of a 3D packaging to enhance the heat transfer within the module. The design of the heat pipe is retained to s...

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Bibliographic Details
Main Authors: Kamenova, L., Avenas, Y., Popova, N., Schaeffer, C., Tzanova, S.
Format: Conference Proceeding
Language:English
Subjects:
Conducting materials
Cooling
Electronic packaging thermal management
Heat transfer
Microelectronics
Powders
Predictive models
Space heating
Testing
Thermal conductivity
Online Access:Request full text
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Summary:This paper presents the conception and the experimental investigation on flat heat pipe with sintered powder wick structure and very thin wails. The heat pipe is integrated in the substrate of a 3D packaging to enhance the heat transfer within the module. The design of the heat pipe is retained to satisfy to the dimensioning, the mechanical and the heat dissipation requirements. The material and the structure have been selected after performing mechanical simulations with ANSYS. 2D hydraulic model to optimize the HP dimensioning and predict the heat capacity of the heat pipe is also presented. The model is in a very good conformity with the experimental results, also described in this paper.
ISSN:2163-5137
DOI:10.1109/ISIE.2007.4374697