Application of Back-side Laser Technique on Failure Analysis

The application of backside emission and laser technique (TIVA/OBIRCH) had been widely used in the semiconductor industry. This paper will discuss the usage of backside laser damage method to aid in this technique on localizing the failure spot. Two applications on backside laser; 1.Memory scramble...

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Bibliographic Details
Main Authors: Hoe, W.L.C., Ren De Lin, Chee Hong Chong, Coswin Lin
Format: Conference Proceeding
Language:English
Subjects:
Costs
Electronics industry
Failure analysis
Glass
Laser applications
Microelectronics
Optimization methods
Semiconductor lasers
Testing
Online Access:Request full text
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Summary:The application of backside emission and laser technique (TIVA/OBIRCH) had been widely used in the semiconductor industry. This paper will discuss the usage of backside laser damage method to aid in this technique on localizing the failure spot. Two applications on backside laser; 1.Memory scramble verification and 2. Yield loss scenario using backside laser to verify the failure hypothesis will also be discussed.
ISSN:1946-1542
1946-1550
DOI:10.1109/IPFA.2007.4378099