Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems

This paper describes electrical, optical, and fluidic (or 'trimodal') chip I/O interconnect networks for gigascale systems to meet and exceed end-of-roadmap projections in the areas of power delivery, off-chip bandwidth, and heat removal, respectively. The trimodal I/O technology is propos...

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Bibliographic Details
Main Authors: Bakir, M.S., Dang, B., Meindl, J.D.
Format: Conference Proceeding
Language:English
Subjects:
Bandwidth
Heat sinks
Integrated circuit interconnections
Microprocessors
Optical interconnections
Power system interconnection
Resistance heating
Silicon
System-on-a-chip
Thermal resistance
Online Access:Request full text
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Summary:This paper describes electrical, optical, and fluidic (or 'trimodal') chip I/O interconnect networks for gigascale systems to meet and exceed end-of-roadmap projections in the areas of power delivery, off-chip bandwidth, and heat removal, respectively. The trimodal I/O technology is proposed to overcome the adverse effects of conventional silicon ancillary technologies on the performance of a gigascale system. We describe trimodal I/O interconnect configurations, fabrication, assembly, and testing.
ISSN:0886-5930
2152-3630
DOI:10.1109/CICC.2007.4405766