Overmolded FC-SiP for Miniaturized Devices

The degree of integration of modern circuits has gone from singledie towards multi-die or even system partition integration. System-In-Package concepts allow to integrate in a hybrid form circuit components steming from different manufacturing processes e.g. CMOS, GaAs, MEMS as well as SMD chips. Co...

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Bibliographic Details
Main Authors: Erik Jung, Koch, M., Becker, K.-F., Bader, V., Aschenbrenner, R., Reichl, H.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
CMOS technology
Flip chip
Gallium arsenide
Integrated circuit interconnections
Integrated circuit reliability
Integrated circuit technology
Manufacturing processes
Micromechanical devices
Paper technology
Online Access:Request full text
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Summary:The degree of integration of modern circuits has gone from singledie towards multi-die or even system partition integration. System-In-Package concepts allow to integrate in a hybrid form circuit components steming from different manufacturing processes e.g. CMOS, GaAs, MEMS as well as SMD chips. Combining Flip Chip technology, advanced PCB manufacturing, advanced assembly processes and large area overmolding, highly integrated and reliable sub-systems can be created. The paper describes the individual process steps for a GSM-Power Amplifier module, integrating the PA as a flip chip with the matching SMD components into a novel QFN concept featuring a laser structured bump-on-pad interconnect technology. Large area overmolding covers and protects the entire subsystem thus created. Manufacturing issues as well as specific fabrication details are highlighted and a reliability test shows the performance of the concept under harsh environmental load.
ISSN:1089-8190
2576-9626
DOI:10.1109/IEMT.2007.4417050