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International technology entrepreneurship: Immersion into interdisciplinary innovation (I5) in Shanghai
Over the past six years, the School of Engineering and Computer Science (ECS) at Baylor University has designed, developed, and successfully implemented an international study abroad program aimed at giving engineering and computer science students an opportunity to study abroad while accruing cours...
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Main Authors: | , |
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Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
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Summary: | Over the past six years, the School of Engineering and Computer Science (ECS) at Baylor University has designed, developed, and successfully implemented an international study abroad program aimed at giving engineering and computer science students an opportunity to study abroad while accruing course credit that counts toward their degree plans. For the past two years this program also integrated the commercial side of innovation by joining with the Hankamer School of Business (HSB), making the program a multidisciplinary experience in International Technology Entrepreneurship. With continuous improvements based on our students' and other constituents' needs and the insights gained during four successful study abroad trips to Europe, the School of Engineering and Computer Science and the Business School are now working to provide an enhanced summer study abroad program in an area of the world where economic growth and innovation are expanding rapidly - China. This paper will document the redesign of the summer abroad experience into a program where technology and business students from American universities are immersed in an intensive six weeks in Shanghai, with technology and business students from China, working on real-world technology innovation with real-world multi-national and Chinese companies. The program will also include critically important training in Chinese cultural awareness, including cultural sensitivity, history, and current business and technology working environments. |
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ISSN: | 0190-5848 2377-634X |
DOI: | 10.1109/FIE.2007.4418164 |