An Approach to Cost-Effective, Robust, Large-Area Electronics using Monolithic Silicon

We have developed an approach to build large-area electronics from monolithic silicon integrated circuits. The method used deep reactive ion etching to structure a monolithic silicon substrate into a stretchable, two-dimensional, wired network that can be expanded to cover large planar or curved sur...

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Bibliographic Details
Main Authors: Kevin Huang, Dinyari, R., Lanzara, G., Jong Yon Kim, Jianmin Feng, Vancura, C., Fu-Kuo Chang, Peumans, P.
Format: Conference Proceeding
Language:English
Subjects:
Capacitive sensors
Etching
Fabrication
Integrated circuit interconnections
Integrated circuit technology
Microelectronics
Robustness
Silicon
Spirals
Springs
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Summary:We have developed an approach to build large-area electronics from monolithic silicon integrated circuits. The method used deep reactive ion etching to structure a monolithic silicon substrate into a stretchable, two-dimensional, wired network that can be expanded to cover large planar or curved surfaces to realize high-performance, large-area, monolithic silicon electronics in a cost-effective manner. This approach has applications in sensing, smart materials, electronic textile,RFID tag and microconcentrator solar cell manufacturing.
ISSN:0163-1918
2156-017X
DOI:10.1109/IEDM.2007.4418906