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Design Considerations of Miniaturized Least Dispersive Periodic Slow-Wave Structures
Slow-wave structures using distributed periodic inductive and capacitive loadings have found many microwave circuit applications as left-handed (bandpass) or right-handed (low-pass) transmission lines. A large slow-wave factor (SWF) could result in a much smaller passive component, but also a much l...
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Published in: | IEEE transactions on microwave theory and techniques 2008-02, Vol.56 (2), p.467-474 |
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container_end_page | 474 |
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container_title | IEEE transactions on microwave theory and techniques |
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creator | Chengzhi Zhou Yang, H.Y.D. |
description | Slow-wave structures using distributed periodic inductive and capacitive loadings have found many microwave circuit applications as left-handed (bandpass) or right-handed (low-pass) transmission lines. A large slow-wave factor (SWF) could result in a much smaller passive component, but also a much lower bandgap (cutoff) frequency and a larger dispersion. This paper addresses the issues and the design tradeoff between the SWF, group delay (dispersion), and the cutoff frequency of a right-handed (low-pass) quasi-lumped transmission line. A new two-layer transmission line structure using 3-D substrate metallization with an SWF of 5.8 is designed. A prototype of a 3-GHz branch-line coupler with a 70% size reduction using such a transmission line structure is fabricated and tested. |
doi_str_mv | 10.1109/TMTT.2007.914633 |
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A large slow-wave factor (SWF) could result in a much smaller passive component, but also a much lower bandgap (cutoff) frequency and a larger dispersion. This paper addresses the issues and the design tradeoff between the SWF, group delay (dispersion), and the cutoff frequency of a right-handed (low-pass) quasi-lumped transmission line. A new two-layer transmission line structure using 3-D substrate metallization with an SWF of 5.8 is designed. A prototype of a 3-GHz branch-line coupler with a 70% size reduction using such a transmission line structure is fabricated and tested.</description><identifier>ISSN: 0018-9480</identifier><identifier>EISSN: 1557-9670</identifier><identifier>DOI: 10.1109/TMTT.2007.914633</identifier><identifier>CODEN: IETMAB</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Bandpass ; Branch-line coupler ; Circuit properties ; Cutoff frequency ; Delay ; Dispersion ; Dispersions ; Distributed parameter circuits ; Electric, optical and optoelectronic circuits ; electromagnetic bandgap (EBG) ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronic tubes, masers ; Electronics ; Exact sciences and technology ; Group delay ; Joining ; Metallization ; Microelectronic fabrication (materials and surfaces technology) ; Microwave circuits ; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits ; Microwaves ; Passive components ; Periodic structures ; Photonic band gap ; Prototypes ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; slow wave ; Transmission lines</subject><ispartof>IEEE transactions on microwave theory and techniques, 2008-02, Vol.56 (2), p.467-474</ispartof><rights>2008 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2008</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c449t-399c1e9abfeb3145346de4bde40dc23fb26406ebef457279f0050a55315ac8053</citedby><cites>FETCH-LOGICAL-c449t-399c1e9abfeb3145346de4bde40dc23fb26406ebef457279f0050a55315ac8053</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4430800$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,54796</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20056618$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Chengzhi Zhou</creatorcontrib><creatorcontrib>Yang, H.Y.D.</creatorcontrib><title>Design Considerations of Miniaturized Least Dispersive Periodic Slow-Wave Structures</title><title>IEEE transactions on microwave theory and techniques</title><addtitle>TMTT</addtitle><description>Slow-wave structures using distributed periodic inductive and capacitive loadings have found many microwave circuit applications as left-handed (bandpass) or right-handed (low-pass) transmission lines. A large slow-wave factor (SWF) could result in a much smaller passive component, but also a much lower bandgap (cutoff) frequency and a larger dispersion. This paper addresses the issues and the design tradeoff between the SWF, group delay (dispersion), and the cutoff frequency of a right-handed (low-pass) quasi-lumped transmission line. A new two-layer transmission line structure using 3-D substrate metallization with an SWF of 5.8 is designed. A prototype of a 3-GHz branch-line coupler with a 70% size reduction using such a transmission line structure is fabricated and tested.</description><subject>Applied sciences</subject><subject>Bandpass</subject><subject>Branch-line coupler</subject><subject>Circuit properties</subject><subject>Cutoff frequency</subject><subject>Delay</subject><subject>Dispersion</subject><subject>Dispersions</subject><subject>Distributed parameter circuits</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>electromagnetic bandgap (EBG)</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronic tubes, masers</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Group delay</subject><subject>Joining</subject><subject>Metallization</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Microwave circuits</subject><subject>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</subject><subject>Microwaves</subject><subject>Passive components</subject><subject>Periodic structures</subject><subject>Photonic band gap</subject><subject>Prototypes</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>slow wave</subject><subject>Transmission lines</subject><issn>0018-9480</issn><issn>1557-9670</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNp9kU1r3DAQhkVpINtN7oFeTKHtyZuR9WHpWHabtrAhgTjkKGR5XBQceyvZCcmvjxYvOfSQw6AZ6XlnJL2EnFFYUQr6vLqsqlUBUK405ZKxD2RBhShzLUv4SBYAVOWaKzgmn2K8TyUXoBak2mD0f_tsPfTRNxjs6FOWDW126Xtvxyn4F2yyLdo4Zhsfdxiif8TsGoMfGu-ym254yu9s2roZw-SSAOMJOWptF_H0sC7J7cXPav073179-rP-sc0d53rMmdaOorZ1izVL92FcNsjrFNC4grV1ITlIrLHloixK3QIIsEIwKqxTINiSfJ_77sLwb8I4mgcfHXad7XGYolGlACZ5-o4l-fYuyTgvVRqXwC__gffDFPr0CqNkQRUwCgmCGXJhiDFga3bBP9jwbCiYvRtm74bZu2FmN5Lk66Gvjc52bbC98_FNl1AhJVWJ-zxzHhHfjjlnoADYK9DOkng</recordid><startdate>20080201</startdate><enddate>20080201</enddate><creator>Chengzhi Zhou</creator><creator>Yang, H.Y.D.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Passive components, printed wiring boards, connectics</topic><topic>Electronic tubes, masers</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Group delay</topic><topic>Joining</topic><topic>Metallization</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Microwave circuits</topic><topic>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</topic><topic>Microwaves</topic><topic>Passive components</topic><topic>Periodic structures</topic><topic>Photonic band gap</topic><topic>Prototypes</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>slow wave</topic><topic>Transmission lines</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chengzhi Zhou</creatorcontrib><creatorcontrib>Yang, H.Y.D.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Xplore</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on microwave theory and techniques</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chengzhi Zhou</au><au>Yang, H.Y.D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Design Considerations of Miniaturized Least Dispersive Periodic Slow-Wave Structures</atitle><jtitle>IEEE transactions on microwave theory and techniques</jtitle><stitle>TMTT</stitle><date>2008-02-01</date><risdate>2008</risdate><volume>56</volume><issue>2</issue><spage>467</spage><epage>474</epage><pages>467-474</pages><issn>0018-9480</issn><eissn>1557-9670</eissn><coden>IETMAB</coden><abstract>Slow-wave structures using distributed periodic inductive and capacitive loadings have found many microwave circuit applications as left-handed (bandpass) or right-handed (low-pass) transmission lines. A large slow-wave factor (SWF) could result in a much smaller passive component, but also a much lower bandgap (cutoff) frequency and a larger dispersion. This paper addresses the issues and the design tradeoff between the SWF, group delay (dispersion), and the cutoff frequency of a right-handed (low-pass) quasi-lumped transmission line. A new two-layer transmission line structure using 3-D substrate metallization with an SWF of 5.8 is designed. A prototype of a 3-GHz branch-line coupler with a 70% size reduction using such a transmission line structure is fabricated and tested.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TMTT.2007.914633</doi><tpages>8</tpages></addata></record> |
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source | IEEE Electronic Library (IEL) Journals |
subjects | Applied sciences Bandpass Branch-line coupler Circuit properties Cutoff frequency Delay Dispersion Dispersions Distributed parameter circuits Electric, optical and optoelectronic circuits electromagnetic bandgap (EBG) Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronic tubes, masers Electronics Exact sciences and technology Group delay Joining Metallization Microelectronic fabrication (materials and surfaces technology) Microwave circuits Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits Microwaves Passive components Periodic structures Photonic band gap Prototypes Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices slow wave Transmission lines |
title | Design Considerations of Miniaturized Least Dispersive Periodic Slow-Wave Structures |
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