A thick photoresist process for open-channel sensing packaging applications by JSR THB-151N negative UV photoresist

In this study, a novel packaging structure for open-channel sensor was successfully demonstrated by using the sacrifice-replacement method. This method was patterned JSR THB-151N photoresist to fabricate an open space to contact medium. The sacrificial-barriers of 75 and 150 mum thickness have been...

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Bibliographic Details
Main Authors: Chung-Yi Hsu, Lung-Tai Chen, Jin-Sheng Chang, Chun-Hsun Chu
Format: Conference Proceeding
Language:English
Subjects:
Coatings
Encapsulation
Fabrication
Magnetic sensors
Plastic packaging
Reproducibility of results
Resists
Space technology
Thermal sensors
Wafer bonding
Online Access:Request full text
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Summary:In this study, a novel packaging structure for open-channel sensor was successfully demonstrated by using the sacrifice-replacement method. This method was patterned JSR THB-151N photoresist to fabricate an open space to contact medium. The sacrificial-barriers of 75 and 150 mum thickness have been fabricated with good reproducibility by using single and double coating processes. Optimized fabrication parameters were achieved straight and nearly vertical sidewall profiles. In addition, after the encapsulation process, JSR photoresist has been stripped clearly and easily without residues in stripper solutions. Finally, the sensing channel was reserved in packaging body resulting from sacrifice-replacement approach.
ISSN:2150-5934
2150-5942
DOI:10.1109/IMPACT.2007.4433619