Advanced monitoring method for copper interconnect process

Stabilizing copper interconnect process is the key for yield and reliability improvement. Forming adequate grains in a copper film is so important to have the stable process, but there is no proper method of monitoring grains in a copper film. We introduce an advanced method of monitoring grain size...

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Bibliographic Details
Main Authors: Ishikawa, K., Ando, T., Ikota, M., Funakoshi, T., Imai, Y., Watanabe, K., Miura, A., Ohta, H., Nemoto, K., Onozuka, T.
Format: Conference Proceeding
Language:English
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Summary:Stabilizing copper interconnect process is the key for yield and reliability improvement. Forming adequate grains in a copper film is so important to have the stable process, but there is no proper method of monitoring grains in a copper film. We introduce an advanced method of monitoring grain size using scattering light that we call the micro-haze method. We verified the effectiveness of the method by the experimental design and concluded that the method makes it possible to monitor grains in a copper film.
ISSN:1523-553X
DOI:10.1109/ISSM.2007.4446837