Preparation and Thermal Characterization of Carbon Nanotubes-Based Composites for Applications in Electronics Packaging

The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelectronic devices. The variation of thermal conductivity as a function of concentration of SW...

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Bibliographic Details
Main Authors: Toschi, F., Tamburri, E., Guglielmotti, V., Terranova, M.L., Reale, A., Di Carlo, A., Passeri, D., Rossi, M., Falessi, C., Fiorello, A., Buttiglione, R.
Format: Conference Proceeding
Language:English
Subjects:
Carbon nanotubes
Dispersion
Electrical resistance measurement
Electronic packaging thermal management
Electronics packaging
Epoxy Resin
Epoxy resins
Nanocomposite
Nanoscale devices
Resistance heating
Thermal conductivity
Thermal Interface Materials
Thermal Management
Thermal resistance
TIM
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Summary:The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelectronic devices. The variation of thermal conductivity as a function of concentration of SWCNT is reported and discussed with reference to the dispersion state of SWCNT in the layers.
DOI:10.1109/ICQNM.2008.20