Prediction of stress-induced characteristic changes for small-scale analog IC

Stress-induced parametric changes during the resin-molded packaging of a small-scale integrated circuit (IC) smaller than 1.0 mm 2 have been evaluated by a specially designed test chip. Multiple test chips with different resistor locations have been fabricated and measured by die-to-die corresponden...

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Bibliographic Details
Main Authors: Ueda, N., Nishiyama, E., Aota, H., Watanabe, H.
Format: Conference Proceeding
Language:English
Subjects:
Analog integrated circuits
Circuit testing
Compressive stress
Electrical resistance measurement
Integrated circuit packaging
Integrated circuit testing
MOSFET circuits
Piezoresistance
Resistors
Semiconductor device measurement
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Description
Summary:Stress-induced parametric changes during the resin-molded packaging of a small-scale integrated circuit (IC) smaller than 1.0 mm 2 have been evaluated by a specially designed test chip. Multiple test chips with different resistor locations have been fabricated and measured by die-to-die correspondence. One contour plot was reproduced from the measurement results. The present paper shows the distribution of parametric change for the small-scale IC. In addition, a new method for evaluating the circuit performance change due to stress-induced parametric changes is presented.
ISSN:1071-9032
2158-1029
DOI:10.1109/ICMTS.2008.4509323