The Fabrication Process of RF Inductor Structures in the LTCC Technology

This paper introduces the LTCC as a novel technology for the fabrication of multilayer microelectronic components. Advantages of the multilayer structure will be presented on the example of the 3D inductor.

Saved in:
Bibliographic Details
Main Authors: Radosavljevic, G., Maric, A., Stojanovic, G., Zivanov, L., Smetana, W., Unger, M., Homolka, H.
Format: Conference Proceeding
Language:English
Subjects:
Ceramics
Conducting materials
Fabrication
Firing
Inductors
LTCC technology
Microelectronics
multilayer structures
Nonhomogeneous media
Optical design
Radio frequency
RF inductor
Temperature
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper introduces the LTCC as a novel technology for the fabrication of multilayer microelectronic components. Advantages of the multilayer structure will be presented on the example of the 3D inductor.
ISSN:1545-827X
DOI:10.1109/SMICND.2007.4519693