Technical review of characterization methods for thermal interface Materials (TIM)

There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is n...

Full description

Saved in:
Bibliographic Details
Main Authors: Goel, N., Anoop, T.K., Bhattacharya, A., Cervantes, J.A., Mongia, R.K., Machiroutu, S.V., Hau-Lan Lin, Ya-Chi Huang, Kuang-Cheng Fan, Bar-Long Denq, Chen-Hua Liu, Chun-Hung Lin, Chi-Wei Tien, Pan, J.-H.
Format: Conference Proceeding
Language:English
Subjects:
ASTM D5470
characterization methods
Conducting materials
Contact resistance
reliability
Rough surfaces
Surface resistance
Surface roughness
Testing
Thermal conductivity
Thermal degradation
Thermal interface material
Thermal management
Thermal resistance
TIM
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering TIM degradation in mobile applications. Various TIM characterization approaches prevalent in industry are discussed in this paper. There is also wide disparity in testing methodologies used across industry to evaluate its performance maps with usage. A set of characterization techniques for better TIM evaluation practices are suggested.
ISSN:1087-9870
2577-0799
DOI:10.1109/ITHERM.2008.4544277