The effects of aging temperature on SAC solder joint material behavior and reliability

The effects of aging on mechanical behavior of lead free solders have been examined by performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) that were aged for various durations (0-4 months) at room temperature (25degC), and several elevated temperatures (75, 100, and...

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Bibliographic Details
Main Authors: Yifei Zhang, Zijie Cai, Suhling, J.C., Lall, P., Bozack, M.J.
Format: Conference Proceeding
Language:English
Subjects:
Aging
Creep
Environmentally friendly manufacturing techniques
Joining materials
Lead
Materials reliability
Performance evaluation
Soldering
Temperature
Testing
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Summary:The effects of aging on mechanical behavior of lead free solders have been examined by performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) that were aged for various durations (0-4 months) at room temperature (25degC), and several elevated temperatures (75, 100, and 125 degC). Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Variations of the creep properties were observed and modeled as a function of aging time and aging temperature. In addition, the chosen selection of SAC alloys has allowed us to explore the effects of silver content on aging behavior.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2008.4549956