A reliability-aware RF power amplifier design for CMOS radio chip integration

For significant cost reduction in Wi-Fi platforms, the power amplifier must be integrated into the CMOS radio RFIC. This paper surveys how this most challenging circuit was carefully engineered to mitigate aging effects, ESD, and thermal issues for deployment into our product platforms. Experimental...

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Bibliographic Details
Main Authors: Ruberto, M., Degani, O., Wail, S., Tendler, A., Fridman, A., Goltman, G.
Format: Conference Proceeding
Language:English
Subjects:
Aging
CMOS
Costs
Electrostatic discharge
ESD
hot carrier
Integrated circuit reliability
power amplifier
Power amplifiers
Power engineering and energy
Radio frequency
Radiofrequency amplifiers
Radiofrequency integrated circuits
reliability
Reliability engineering
RFIC
thermal
Wi-Fi
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Description
Summary:For significant cost reduction in Wi-Fi platforms, the power amplifier must be integrated into the CMOS radio RFIC. This paper surveys how this most challenging circuit was carefully engineered to mitigate aging effects, ESD, and thermal issues for deployment into our product platforms. Experimental results are also presented here.
ISSN:1541-7026
1938-1891
DOI:10.1109/RELPHY.2008.4558942