Steady state thermal analysis of a reconfigurable wafer-scale circuit board

During the development of a reconfigurable wafer-scale circuit board, the thermal design aspects have proved crucial to its reliable operation. Reducing thermally induced stress and preventing local overheating remain major concerns when optimizing the capabilities of the WaferBoard TM technology. T...

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Bibliographic Details
Main Authors: Bougataya, M., Lakhsasi, A., Norman, R., Prytula, R., Blaquiere, Y., Savaria, Y.
Format: Conference Proceeding
Language:English
Subjects:
Boundary conditions
Finite Element
Finite element methods
Heat transfer
Junction temperature
Predictive models
Printed circuits
Semiconductor device modeling
Steady-state
Temperature
Thermal analysis
Thermal conductivity
Thermal loading
Thermal stresses
VLSI
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Summary:During the development of a reconfigurable wafer-scale circuit board, the thermal design aspects have proved crucial to its reliable operation. Reducing thermally induced stress and preventing local overheating remain major concerns when optimizing the capabilities of the WaferBoard TM technology. This paper presents a thermal analysis of that technology. For this study, various thermal boundary conditions are analyzed and thermal profiles with 3D thermal contours are presented. 3D finite element thermal models are used to predict local thermal peaks on the WaferBoardTM structure. This model allows exploring the possibilities to minimize the thermal gradient in the critical areas, especially at the solder balls level. In a second step, thermal stress analysis will be conducted using the temperature loads calculated by steady state thermal analysis.
ISSN:0840-7789
2576-7046
DOI:10.1109/CCECE.2008.4564567