3D Contactless communication for IC design

3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions,...

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Bibliographic Details
Main Authors: Canegallo, R., Ciccarelli, L., Natali, F., Fazzi, A., Guerrieri, R., Rolandi, P.
Format: Conference Proceeding
Language:English
Subjects:
3D Integration
AC interconnections
Bonding
capacitive coupling
CMOS technology
Coupling circuits
High speed integrated circuits
Integrated circuit interconnections
inter chip communication
Power system interconnection
Signal design
Stress
Transmitters
Wire
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Description
Summary:3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme with transmitter and receiver circuits implemented in 0.13mum CMOS technology and connected to 8x8mum 2 electrodes in the upper metal layer of different dies and with face-to-face assembly, makes available a throughput of more than 22Mbps/mum 2 with 80muW/Gbps energy consumption.
ISSN:2381-3555
2691-0462
DOI:10.1109/ICICDT.2008.4567286