An Experimental Investigation of a Heat Pipe Integrated Power Module

• Main Authors: YaPing Zhang, Xiaoling Yu, QuanKe Feng
• Format: Conference Proceeding
• Language: English
• ISSN: 2156-2318; 2158-2297
• DOI: 10.1109/ICIEA.2008.4582629

A novel flat plat heat pipe (FPHP) integrated in high power module instead of metal substrate is developed. Compared with the metal subtrate, the FPHP uses two-phase boiling heat transfer to diffuse heat flux in power module.Thus the FPHP diffuses significantly the collect heat source to the more larger condensation area. Analyze the use of a FPHP as a heat spreader to spread out the heat from the die to the heat sink.The transient and steady heat transfer performance of the FPHP was experimentally measured.The experiment indicates that the FPHP of isothermal and high convection coefficient can improve the heat transfer capacity for the integrated power electronic module (IPEM), which make thermal resistance decrease 30 percent. The maximum thermal flux density of IGBT die is obtained to 186 W/cm 2 . IPEM based on FPHP can avoid the power uprush and raise the ability of resisting thermal impact.