An 8192-point fast fourier transform 3D-IC case study

3D stacking and integration can provide system advantages. This paper explores an application driver for 3D ICs. Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. Another promising application area is that of logic-on-memory. This paper presen...

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Bibliographic Details
Main Authors: Davis, W.R., Sule, A.M., Franzon, P.D.
Format: Conference Proceeding
Language:English
Subjects:
Clocks
Delay
Fast Fourier transforms
Integrated circuit interconnections
Pipelines
Three dimensional displays
Wire
Online Access:Request full text
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Summary:3D stacking and integration can provide system advantages. This paper explores an application driver for 3D ICs. Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. Another promising application area is that of logic-on-memory. This paper presents a case studies of an 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180 nm 3D process. The FFT shows a 22% reduction in cycle-time, coupled with an 18% reduction in energy per transform.
ISSN:1548-3746
1558-3899
DOI:10.1109/MWSCAS.2008.4616830