Laser cleaving method using thermal induced stress for FPD's and wafer materials

Cleaving of brittle materials is a non-ablating high potential process based on thermal-induced-stress. Amorphous materials such as glass can be separated as well as crystalline structures using near-infrared laser radiation and multiple absorption technology.

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Bibliographic Details
Main Authors: Haupt, O., Stute, U.
Format: Conference Proceeding
Language:English
Subjects:
(140.3390) Laser material processing
(160.2750) Glass and other amorphous materials
Glass
Laser ablation
Laser beam cutting
Materials
Power generation
Power lasers
Thermal stresses
Online Access:Request full text
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Description
Summary:Cleaving of brittle materials is a non-ablating high potential process based on thermal-induced-stress. Amorphous materials such as glass can be separated as well as crystalline structures using near-infrared laser radiation and multiple absorption technology.
ISSN:2160-9004
DOI:10.1109/CLEO.2006.4628855