Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding

Thermocompression bonding of InP lasers to 4 mum thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.

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Bibliographic Details
Main Authors: Kapulainen, M., Ylinen, S., Aalto, T., Harjanne, M., Solehmainen, K., Ollila, J., Vilokkinen, V.
Format: Conference Proceeding
Language:English
Subjects:
Accuracy
Bonding
Gold
Measurement by laser beam
Optical waveguides
Silicon on insulator technology
Waveguide lasers
Online Access:Request full text
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Description
Summary:Thermocompression bonding of InP lasers to 4 mum thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.
ISSN:1949-2081
1949-209X
DOI:10.1109/GROUP4.2008.4638097