Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding

Thermocompression bonding of InP lasers to 4 mum thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.

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Main Authors: Kapulainen, M., Ylinen, S., Aalto, T., Harjanne, M., Solehmainen, K., Ollila, J., Vilokkinen, V.
Format: Conference Proceeding
Language:English
Subjects:
Accuracy
Bonding
Gold
Measurement by laser beam
Optical waveguides
Silicon on insulator technology
Waveguide lasers
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container_start_page 61
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creator Kapulainen, M.
Ylinen, S.
Aalto, T.
Harjanne, M.
Solehmainen, K.
Ollila, J.
Vilokkinen, V.
description Thermocompression bonding of InP lasers to 4 mum thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.
doi_str_mv 10.1109/GROUP4.2008.4638097
format conference_proceeding
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ispartof 2008 5th IEEE International Conference on Group IV Photonics, 2008, p.61-63
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Accuracy
Bonding
Gold
Measurement by laser beam
Optical waveguides
Silicon on insulator technology
Waveguide lasers
title Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding
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