Differential vias transition modeling in a multilayer printed circuit board

A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and ey...

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Bibliographic Details
Main Authors: Cocchini, M., Wheling Cheng, Jianmin Zhang, Fisher, J., Fan, J., Drewniak, J.L., Yaojiang Zhang
Format: Conference Proceeding
Language:English
Subjects:
Capacitance
cavity model
Dielectric measurements
Differential signal
Frequency measurement
Geometry
ground vias
Integrated circuit modeling
noise coupling
signal via transition
Stripline
Transmission line measurements
via capacitance
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Description
Summary:A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model has been generated as well. The paper will show that the process of modeling can require a series of adjustments to get reasonable results. A brief discussion about possible issues associated with fabrication tolerances is presented in the last chapter.
ISSN:2158-110X
2158-1118
DOI:10.1109/ISEMC.2008.4652164