3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

This paper describes a novel 3D integration technology that enables the integration of electrical, optical, and microfluidic interconnects in a 3D die stack. The electrical interconnects are used to provide power delivery and signaling, the optical interconnects are used to enable optical signal rou...

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Bibliographic Details
Main Authors: Bakir, M.S., King, C., Sekar, D., Thacker, H., Bing Dang, Gang Huang, Naeemi, A., Meindl, J.D.
Format: Conference Proceeding
Language:English
Subjects:
Integrated optics
Liquid cooling
Microfluidics
Optical interconnections
Optical pumping
Power system interconnection
Routing
Stacking
Thermal resistance
Through-silicon vias
Online Access:Request full text
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Description
Summary:This paper describes a novel 3D integration technology that enables the integration of electrical, optical, and microfluidic interconnects in a 3D die stack. The electrical interconnects are used to provide power delivery and signaling, the optical interconnects are used to enable optical signal routing to all levels of the 3D stack, and the microfluidic interconnects are used to cool each level in the 3D stack and thus enable stacking of high-performance (high-power) dice. These interconnects are integrated in a 3D stack both as through-silicon vias (TSVs) and as input/output (I/O) interconnects. Design trade-offs (TSV density, power supply noise, thermal resistance, and pump size), fabrication, and assembly are reported.
ISSN:0886-5930
2152-3630
DOI:10.1109/CICC.2008.4672173