Effects of partially broken HF signal return on different packaging levels

Electro magnetic field effects for broken high frequency (HF) signal returns are analysed for discontinuities in different packaging levels. Board connectors with a huge signal count and high speed signals as well as typical multi chip module structures are analysed using 3D field calculations. Resu...

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Bibliographic Details
Main Authors: Winkel, T.-M., Frech, R., Gneiting, T.
Format: Conference Proceeding
Language:English
Subjects:
Connectors
Couplings
Frequency
Hafnium
Magnetic analysis
Magnetic field measurement
Packaging
Signal analysis
Voltage
Wires
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Description
Summary:Electro magnetic field effects for broken high frequency (HF) signal returns are analysed for discontinuities in different packaging levels. Board connectors with a huge signal count and high speed signals as well as typical multi chip module structures are analysed using 3D field calculations. Resulting coupling effects were calculated and also verified with time domain measurements. The results are discussed with respect to the impact on signal integrity.
ISSN:2165-4107
DOI:10.1109/EPEP.2008.4675928