Boundary-Scan Testing of Power/Ground Pins

Most integrated circuits today possess large numbers of power and ground pins in addition to signal pins. Boundary-scan technology will adequately test the signals, but in general does not address open defects on the power/ground pins. Some ICs could get at least partial coverage on some of these pi...

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Bibliographic Details
Main Authors: Parker, K.P., Jacobson, N.G.
Format: Conference Proceeding
Language:English
Subjects:
Circuit testing
Educational institutions
Integrated circuit modeling
Integrated circuit packaging
Integrated circuit technology
Integrated circuit testing
Jacobian matrices
Pins
Power engineering and energy
Rails
Online Access:Request full text
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Description
Summary:Most integrated circuits today possess large numbers of power and ground pins in addition to signal pins. Boundary-scan technology will adequately test the signals, but in general does not address open defects on the power/ground pins. Some ICs could get at least partial coverage on some of these pins due to their internal power/ground distribution structure. Thus boundary-scan could be used to test, diagnose and claim coverage for these defects. What is needed is an extension to BSDL to support this capability.
ISSN:1089-3539
2378-2250
DOI:10.1109/TEST.2008.4700628