Boundary-Scan Testing of Power/Ground Pins

Most integrated circuits today possess large numbers of power and ground pins in addition to signal pins. Boundary-scan technology will adequately test the signals, but in general does not address open defects on the power/ground pins. Some ICs could get at least partial coverage on some of these pi...

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Main Authors: Parker, K.P., Jacobson, N.G.
Format: Conference Proceeding
Language:English
Subjects:
Circuit testing
Educational institutions
Integrated circuit modeling
Integrated circuit packaging
Integrated circuit technology
Integrated circuit testing
Jacobian matrices
Pins
Power engineering and energy
Rails
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Jacobson, N.G.
description Most integrated circuits today possess large numbers of power and ground pins in addition to signal pins. Boundary-scan technology will adequately test the signals, but in general does not address open defects on the power/ground pins. Some ICs could get at least partial coverage on some of these pins due to their internal power/ground distribution structure. Thus boundary-scan could be used to test, diagnose and claim coverage for these defects. What is needed is an extension to BSDL to support this capability.
doi_str_mv 10.1109/TEST.2008.4700628
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Circuit testing
Educational institutions
Integrated circuit modeling
Integrated circuit packaging
Integrated circuit technology
Integrated circuit testing
Jacobian matrices
Pins
Power engineering and energy
Rails
title Boundary-Scan Testing of Power/Ground Pins
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