Reliability of the 3-D computer under stress of mechanical vibration and thermal cycling

An assessment of the mechanical reliability of the 3-D Computer is presented. The purpose of this reliability assessment was to gain confidence in the feasibility of this stacked-wafer approach for space-based applications. The investigation addressed both the mechanical and thermal reliability by m...

Full description

Saved in:
Bibliographic Details
Main Authors: Kallis, J.M., Duncan, L.B., Laub, S.P., Little, M.J., Miani, L.M., Sandkulla, D.C.
Format: Conference Proceeding
Language:English
Subjects:
Aircraft
Application software
Assembly
Concurrent computing
Integrated circuit interconnections
Laboratories
Microelectronics
Signal processing
Thermal stresses
Vibrations
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:An assessment of the mechanical reliability of the 3-D Computer is presented. The purpose of this reliability assessment was to gain confidence in the feasibility of this stacked-wafer approach for space-based applications. The investigation addressed both the mechanical and thermal reliability by means of analyses and experiments.< >
DOI:10.1109/WAFER.1989.47537