Fast-Cure Lid Adhesive Development for Microprocessors

A lid or heat spreader is used for packaging microprocessor chips. There are two primary functions for the lid: dissipate heat efficiently from the microprocessor and provide physical protection to the fragile silicon die. To achieve these two functions, lid material, thermal interface material, lid...

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Bibliographic Details
Main Authors: Kee-Hean Keok, Too, S., Diep, J., Quah Hong Tat, Fumihiro, A., Kim Le
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Bonding
Materials processing
Microprocessor chips
Organic materials
Packaging
Protection
Silicon
Thermal stresses
Thermomechanical processes
Online Access:Request full text
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Summary:A lid or heat spreader is used for packaging microprocessor chips. There are two primary functions for the lid: dissipate heat efficiently from the microprocessor and provide physical protection to the fragile silicon die. To achieve these two functions, lid material, thermal interface material, lid adhesive and assembly process are key areas of development. Lid adhesive has a critical role in ensuring the whole microprocessor package meets thermal and thermo-mechanical reliability requirements for the microprocessor. Lid adhesive has to provide a good and consistent bonding strength to secure the lid to the organic substrate under various application conditions. At the same time, it also needs to absorb the stresses in the microprocessor package due to thermal mismatch of various materials: silicon, underfill, organic substrate, and lid. Another less known function of lid and adhesive is package warpage reduction. This paper discusses a low-stress lid adhesive material development that features a wide material processing window and fast-cure capability for assembly throughput improvement.
DOI:10.1109/EPTC.2008.4763542