Fabrication of Multi-Scale Triangular Patch High Impedance Ground Planes to Improve the Bandwidth of Conformal Bow-Tie Antennas for Remote Sensing

The realization and performance is demonstrated of a conformal bow-tie antenna printed on a multi-scale triangular element mushroom structure high-impedance ground-plane (HIGP). The two-scale HIGP was designed to exhibit a large frequency band-gap to cover the relatively broad operational frequency...

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Bibliographic Details
Main Authors: Cakiroglu, B., Collins, P.J., Havrilla, M.J., Sertel, K., Terzuoli, A.J.
Format: Conference Proceeding
Language:English
Subjects:
Antenna measurements
Antennas
Bandwidth
Broadband antennas
Dipole antennas
Fabrication
Frequency
High Impedance Ground Planes
Impedance
Photonic band gap
Remote sensing
Resonance
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Summary:The realization and performance is demonstrated of a conformal bow-tie antenna printed on a multi-scale triangular element mushroom structure high-impedance ground-plane (HIGP). The two-scale HIGP was designed to exhibit a large frequency band-gap to cover the relatively broad operational frequency bandwidth of the bow-tie antenna. HIGP elements were chosen to be triangular to form a natural commensurate blending of the bow-tie into the structure. The experimental performance is characterized of the bow-tie-HIGP combination from 2-10 GHz, and it is demonstrated that the negative effects of a perfect electric conductor ground-plane may be mitigated by using a HIGP.
ISSN:2153-6996
2153-7003
DOI:10.1109/IGARSS.2008.4779996