Loading…

Temperature-aware dynamic frequency and voltage scaling for reliability and yield enhancement

A novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in system-on-chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip...

Full description

Saved in:
Bibliographic Details
Main Authors: Yu-Wei Yang, Shu-Min Li, K.
Format: Conference Proceeding
Language:English
Subjects:
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by
cites
container_end_page 54
container_issue
container_start_page 49
container_title
container_volume
creator Yu-Wei Yang
Shu-Min Li, K.
description A novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in system-on-chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip temperature sensing mechanism. An efficient dynamic frequency-to-voltage scaling (DF2VS) algorithm is proposed to dynamically adjust supply voltage according to the oscillation frequencies of the ring oscillators distributed in SoC so that thermal sensing can be carried at all potential hot spots. An on-chip Dynamic Voltage Scaling or Dynamic Voltage and Frequency Scaling (DVS or DVFS) monitor selects the supply voltage level and clock frequency according to the outputs of all thermal sensors. Experimental results on SoC benchmark circuits show the effectiveness of the algorithm that a 10% reduction in supply voltage alone can achieve about 20% power reduction (DVS scheme), and nearly 50% reduction in power is achievable if the clock frequency is also scaled down (DVFS scheme). The chip temperature is reduced accordingly.
doi_str_mv 10.1109/ASPDAC.2009.4796440
format conference_proceeding
fullrecord <record><control><sourceid>ieee_CHZPO</sourceid><recordid>TN_cdi_ieee_primary_4796440</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4796440</ieee_id><sourcerecordid>4796440</sourcerecordid><originalsourceid>FETCH-LOGICAL-g216t-f8f53edfa6bfe3f53a610271c62cbb3ff72983b8c6bebf84df251bf694b1c9aa3</originalsourceid><addsrcrecordid>eNpVUNtKAzEUjJeCtfYL-pIf2JrbZpPHUq8gKFjBFykn2ZMa2d3W7FbZv7fSIjgvMzDDMAwhE86mnDN7OXt-uprNp4IxO1WF1UqxIzK2heFKKCUKZe0xGQqey0zb4vXkn2fE6Z-n-YCc72qMZVoJc0bGbfvBdsiZKDgbkrcF1htM0G0TZvANCWnZN1BHT0PCzy02vqfQlPRrXXWwQtp6qGKzomGdaMIqgotV7PaZPmJVUmzeofFYY9NdkEGAqsXxgUfk5eZ6Mb_LHh5v7-ezh2wluO6yYEIusQygXUC506D57z6vhXdOhlAIa6QzXjt0wagyiJy7oK1y3FsAOSKTfW9ExOUmxRpSvzw8J38AYxpeVQ</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Temperature-aware dynamic frequency and voltage scaling for reliability and yield enhancement</title><source>IEEE Xplore All Conference Series</source><creator>Yu-Wei Yang ; Shu-Min Li, K.</creator><creatorcontrib>Yu-Wei Yang ; Shu-Min Li, K.</creatorcontrib><description>A novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in system-on-chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip temperature sensing mechanism. An efficient dynamic frequency-to-voltage scaling (DF2VS) algorithm is proposed to dynamically adjust supply voltage according to the oscillation frequencies of the ring oscillators distributed in SoC so that thermal sensing can be carried at all potential hot spots. An on-chip Dynamic Voltage Scaling or Dynamic Voltage and Frequency Scaling (DVS or DVFS) monitor selects the supply voltage level and clock frequency according to the outputs of all thermal sensors. Experimental results on SoC benchmark circuits show the effectiveness of the algorithm that a 10% reduction in supply voltage alone can achieve about 20% power reduction (DVS scheme), and nearly 50% reduction in power is achievable if the clock frequency is also scaled down (DVFS scheme). The chip temperature is reduced accordingly.</description><identifier>ISSN: 2153-6961</identifier><identifier>ISBN: 9781424427482</identifier><identifier>ISBN: 1424427487</identifier><identifier>EISSN: 2153-697X</identifier><identifier>EISBN: 9781424427499</identifier><identifier>EISBN: 1424427495</identifier><identifier>DOI: 10.1109/ASPDAC.2009.4796440</identifier><identifier>LCCN: 2008906428</identifier><language>eng</language><publisher>IEEE</publisher><subject>Clocks ; Dynamic voltage scaling ; Frequency ; Monitoring ; Ring oscillators ; System-on-a-chip ; Temperature sensors ; Thermal sensors ; Voltage control ; Voltage-controlled oscillators</subject><ispartof>2009 Asia and South Pacific Design Automation Conference, 2009, p.49-54</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4796440$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54555,54920,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4796440$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Yu-Wei Yang</creatorcontrib><creatorcontrib>Shu-Min Li, K.</creatorcontrib><title>Temperature-aware dynamic frequency and voltage scaling for reliability and yield enhancement</title><title>2009 Asia and South Pacific Design Automation Conference</title><addtitle>ASPDAC</addtitle><description>A novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in system-on-chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip temperature sensing mechanism. An efficient dynamic frequency-to-voltage scaling (DF2VS) algorithm is proposed to dynamically adjust supply voltage according to the oscillation frequencies of the ring oscillators distributed in SoC so that thermal sensing can be carried at all potential hot spots. An on-chip Dynamic Voltage Scaling or Dynamic Voltage and Frequency Scaling (DVS or DVFS) monitor selects the supply voltage level and clock frequency according to the outputs of all thermal sensors. Experimental results on SoC benchmark circuits show the effectiveness of the algorithm that a 10% reduction in supply voltage alone can achieve about 20% power reduction (DVS scheme), and nearly 50% reduction in power is achievable if the clock frequency is also scaled down (DVFS scheme). The chip temperature is reduced accordingly.</description><subject>Clocks</subject><subject>Dynamic voltage scaling</subject><subject>Frequency</subject><subject>Monitoring</subject><subject>Ring oscillators</subject><subject>System-on-a-chip</subject><subject>Temperature sensors</subject><subject>Thermal sensors</subject><subject>Voltage control</subject><subject>Voltage-controlled oscillators</subject><issn>2153-6961</issn><issn>2153-697X</issn><isbn>9781424427482</isbn><isbn>1424427487</isbn><isbn>9781424427499</isbn><isbn>1424427495</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2009</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNpVUNtKAzEUjJeCtfYL-pIf2JrbZpPHUq8gKFjBFykn2ZMa2d3W7FbZv7fSIjgvMzDDMAwhE86mnDN7OXt-uprNp4IxO1WF1UqxIzK2heFKKCUKZe0xGQqey0zb4vXkn2fE6Z-n-YCc72qMZVoJc0bGbfvBdsiZKDgbkrcF1htM0G0TZvANCWnZN1BHT0PCzy02vqfQlPRrXXWwQtp6qGKzomGdaMIqgotV7PaZPmJVUmzeofFYY9NdkEGAqsXxgUfk5eZ6Mb_LHh5v7-ezh2wluO6yYEIusQygXUC506D57z6vhXdOhlAIa6QzXjt0wagyiJy7oK1y3FsAOSKTfW9ExOUmxRpSvzw8J38AYxpeVQ</recordid><startdate>200901</startdate><enddate>200901</enddate><creator>Yu-Wei Yang</creator><creator>Shu-Min Li, K.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200901</creationdate><title>Temperature-aware dynamic frequency and voltage scaling for reliability and yield enhancement</title><author>Yu-Wei Yang ; Shu-Min Li, K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-g216t-f8f53edfa6bfe3f53a610271c62cbb3ff72983b8c6bebf84df251bf694b1c9aa3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Clocks</topic><topic>Dynamic voltage scaling</topic><topic>Frequency</topic><topic>Monitoring</topic><topic>Ring oscillators</topic><topic>System-on-a-chip</topic><topic>Temperature sensors</topic><topic>Thermal sensors</topic><topic>Voltage control</topic><topic>Voltage-controlled oscillators</topic><toplevel>online_resources</toplevel><creatorcontrib>Yu-Wei Yang</creatorcontrib><creatorcontrib>Shu-Min Li, K.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore (Online service)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yu-Wei Yang</au><au>Shu-Min Li, K.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Temperature-aware dynamic frequency and voltage scaling for reliability and yield enhancement</atitle><btitle>2009 Asia and South Pacific Design Automation Conference</btitle><stitle>ASPDAC</stitle><date>2009-01</date><risdate>2009</risdate><spage>49</spage><epage>54</epage><pages>49-54</pages><issn>2153-6961</issn><eissn>2153-697X</eissn><isbn>9781424427482</isbn><isbn>1424427487</isbn><eisbn>9781424427499</eisbn><eisbn>1424427495</eisbn><abstract>A novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in system-on-chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip temperature sensing mechanism. An efficient dynamic frequency-to-voltage scaling (DF2VS) algorithm is proposed to dynamically adjust supply voltage according to the oscillation frequencies of the ring oscillators distributed in SoC so that thermal sensing can be carried at all potential hot spots. An on-chip Dynamic Voltage Scaling or Dynamic Voltage and Frequency Scaling (DVS or DVFS) monitor selects the supply voltage level and clock frequency according to the outputs of all thermal sensors. Experimental results on SoC benchmark circuits show the effectiveness of the algorithm that a 10% reduction in supply voltage alone can achieve about 20% power reduction (DVS scheme), and nearly 50% reduction in power is achievable if the clock frequency is also scaled down (DVFS scheme). The chip temperature is reduced accordingly.</abstract><pub>IEEE</pub><doi>10.1109/ASPDAC.2009.4796440</doi><tpages>6</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 2153-6961
ispartof 2009 Asia and South Pacific Design Automation Conference, 2009, p.49-54
issn 2153-6961
2153-697X
language eng
recordid cdi_ieee_primary_4796440
source IEEE Xplore All Conference Series
subjects Clocks
Dynamic voltage scaling
Frequency
Monitoring
Ring oscillators
System-on-a-chip
Temperature sensors
Thermal sensors
Voltage control
Voltage-controlled oscillators
title Temperature-aware dynamic frequency and voltage scaling for reliability and yield enhancement
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T14%3A49%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_CHZPO&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Temperature-aware%20dynamic%20frequency%20and%20voltage%20scaling%20for%20reliability%20and%20yield%20enhancement&rft.btitle=2009%20Asia%20and%20South%20Pacific%20Design%20Automation%20Conference&rft.au=Yu-Wei%20Yang&rft.date=2009-01&rft.spage=49&rft.epage=54&rft.pages=49-54&rft.issn=2153-6961&rft.eissn=2153-697X&rft.isbn=9781424427482&rft.isbn_list=1424427487&rft_id=info:doi/10.1109/ASPDAC.2009.4796440&rft.eisbn=9781424427499&rft.eisbn_list=1424427495&rft_dat=%3Cieee_CHZPO%3E4796440%3C/ieee_CHZPO%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-g216t-f8f53edfa6bfe3f53a610271c62cbb3ff72983b8c6bebf84df251bf694b1c9aa3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4796440&rfr_iscdi=true