Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-...

Full description

Saved in:
Bibliographic Details
Main Authors: Bernassau, A.L., Hutson, D., Demore, C.E.M., Cochran, S.
Format: Conference Proceeding
Language:English
Subjects:
acoustic properties
Biomedical electrodes
Biomedical imaging
Biomedical transducers
cure temperature
Epoxy adhesive
Frequency
high frequency array
High-resolution imaging
Image resolution
Immune system
material properties
photolithography
Ultrasonic imaging
Ultrasonic transducer arrays
Ultrasonic transducers
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.
ISSN:1051-0117
DOI:10.1109/ULTSYM.2008.0016