Thermo-mechanical reliability considerations with dynamic voltage/frequency scaling in microprocessor applications

With each advancing generation of process technology, the CPU power continues to rise, creating additional issues for thermal/mechanical packaging design. A common theme in next-generation CPU offerings will be the use of dynamic voltage and frequency scaling (DVFS) to manage the chip power during o...

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Bibliographic Details
Main Authors: Ankireddi, S., Copeland, D.
Format: Conference Proceeding
Language:English
Subjects:
CPU power
DVFS
Dynamic voltage scaling
Energy management
Frequency
Microprocessors
Packaging
Power generation
Power system management
Power system reliability
System identification
thermo-mechanical reliability
Thermomechanical processes
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Summary:With each advancing generation of process technology, the CPU power continues to rise, creating additional issues for thermal/mechanical packaging design. A common theme in next-generation CPU offerings will be the use of dynamic voltage and frequency scaling (DVFS) to manage the chip power during operation. With a DVFS policy, it becomes all the more important to study the potential impacts of imposed temporal variation in power on the thermo-mechanical reliability. In this study, we demonstrate a system identification approach for a practical CPU application and exemplify the trade-offs involved in creating a DVFS policy that is satisfactory to both thermal/mechanical reliability engineers and CPU design teams.
ISSN:1065-2221
2577-1000
DOI:10.1109/STHERM.2009.4810754