Advanced embedded active assemblies for extreme space applications

This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compress...

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Bibliographic Details
Main Authors: Del Castillo, L., Moussessian, A., Mojarradi, M., Kolawa, E., Johnson, R.W., Blalock, B.J.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Biomembranes
Flexible printed circuits
Gold
Joining processes
Liquid crystal polymers
Mars
Operational amplifiers
Silicon
Space technology
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Summary:This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from -135 to +85degC (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications.
ISSN:1095-323X
2996-2358
DOI:10.1109/AERO.2009.4839527