Advanced SOI CMOS transistor technology for high performance microprocessors

In this paper we present, an overview of partial depleted Silicon on Insulator (PD SOI) CMOS transistor technologies for high performance microprocessors. To achieve a ldquohigh performance per wattrdquo figure of merit, transistor technology elements like PD SOI, strained Si, aggressive junction sc...

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Bibliographic Details
Main Authors: Horstmann, M., Wiatr, M., Wei, A., Hoentschel, J., Feudel, T., Scheiper, T., Stephan, R., Gerhadt, M., Raab, M.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
CMOS process
CMOS technology
High K dielectric materials
High-K gate dielectrics
Manufacturing
Microprocessors
Silicon on insulator technology
Transistors
Tunneling
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Summary:In this paper we present, an overview of partial depleted Silicon on Insulator (PD SOI) CMOS transistor technologies for high performance microprocessors. To achieve a ldquohigh performance per wattrdquo figure of merit, transistor technology elements like PD SOI, strained Si, aggressive junction scaling, asymmetric devices need hand-in-hand development with multiple core- and power efficient designs. These techniques have been developed, applied and optimized for 65/45 nm volume manufacturing at GLOBALFOUNDRIES in Dresden. To enable further transistor scaling to 32 nm design rules, High K Metal Gate (HKMG) technology is key. Different HKMG integrations as well as future strained Si technologies like strained silicon directly bonded on SOI and embedded Si:C are discussed.
DOI:10.1109/ULIS.2009.4897527