Simplified Measuring Method of Copper Concentration in Solder Bath Utilizing Copper Dissolution

In lead-free soldering on printed circuit boards (PCBs), the dissolution and disappearance of PCB copper electrodes in solder bath has been a problem for the dip soldering method, such as wave soldering, in which PCBs are dipped in molten solder. In the former report, it has been estimated the influ...

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2009-07, Vol.32 (3), p.138-143
Main Authors: Izuta, G., Tanabe, T., Suganuma, K.
Format: Article
Language:English
Subjects:
Applied sciences
Assembly
CIRCUIT BOARDS
Copper
Copper alloys
COPPER ALLOYS (40 TO 99.3 CU)
Copper base alloys
Copper concentration
copper dissolution
Design. Technologies. Operation analysis. Testing
DIP SOLDERING
Dipping
DISSOLUTION
ELECTRODES
Electronic equipment
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Environmentally friendly manufacturing techniques
Exact sciences and technology
Integrated circuits
Iron alloys
Lead
lead-free solder
MEASUREMENT
measuring method
printed circuit board (PCB)
Printed circuit boards
PRINTED CIRCUITS
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
solder bath
Soldering
SOLDERING ALLOYS
Solders
Temperature
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Description
Summary:In lead-free soldering on printed circuit boards (PCBs), the dissolution and disappearance of PCB copper electrodes in solder bath has been a problem for the dip soldering method, such as wave soldering, in which PCBs are dipped in molten solder. In the former report, it has been estimated the influence of solder composition, temperature, and flowing velocity on the dissolution of copper electrodes by the experiment of the dip soldering process and clarified the dissolution rate for Sn-3.0Ag-xCu alloys, which is defined by solder temperature and copper concentration. Based on above study, the simplified measuring method of copper concentration in the solder bath has been developed, which uses the dissolution of wedge-shaped copper pattern formed on FR-4 PCB. As a result of the experiment on dipping the PCB in solder of Sn-3.0Ag-xCu (x = 0.5, 0.9, 1.2 and 1.5) alloys, it has been confirmed that the method enables the measuring copper concentration in the solder bath easily.
ISSN:1521-334X
1558-0822
DOI:10.1109/TEPM.2009.2021259