E-TQHS: an enhanced performance tape carrier package

In this paper, we discuss the design, development and analyze the electrical performance advantages of a new tape carrier package called E-TQHS (Enhanced Thin Quad Heat Spreader) for submicron ASICs. Compared to the fine pitch plastic QFPs and metal QFPs, the developed package with the feature of pr...

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Bibliographic Details
Main Authors: Pochang Hsu, Raab, K.R.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Bonding
Costs
Electronics packaging
Integrated circuit packaging
Large scale integration
Packaging machines
Performance analysis
Printed circuits
Surface-mount technology
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Summary:In this paper, we discuss the design, development and analyze the electrical performance advantages of a new tape carrier package called E-TQHS (Enhanced Thin Quad Heat Spreader) for submicron ASICs. Compared to the fine pitch plastic QFPs and metal QFPs, the developed package with the feature of programmable single-point downbondings offers finer pad pitch solution, better performance and compatible surface mount interface to circuit boards. Design parametric analysis is also performed to understand its impact on electrical performance for future package improvement.
ISSN:0569-5503
DOI:10.1109/ECTC.1995.514386