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Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip
We have examined the use of the ATCO4 piezoresistive Assembly Test Chip to measure the mechanical surface stresses produced by liquid encapsulation of die mounted directly on ceramic substrates. In our experiment, two groups of parts, each with about 70 samples, were encapsulated with two different...
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| creator | Sweet, J.N. Peterson, D.W. Emerson, J.A. Mitchell, R.T. |
| description | We have examined the use of the ATCO4 piezoresistive Assembly Test Chip to measure the mechanical surface stresses produced by liquid encapsulation of die mounted directly on ceramic substrates. In our experiment, two groups of parts, each with about 70 samples, were encapsulated with two different materials, one a standard and one a low stress formulation. Results are presented for the measured stress components; /spl sigma//sub xx/-/spl sigma//sub zz/, /spl sigma//sub xy/, and /spl sigma//sub xx/-/spl sigma//sub yy/. We observe an /spl ap/20% reduction in the compressive stress between the normal stress and low stress materials, and a small but measurable difference in the average in-plane shearing stress. This experiment demonstrates the ability to resolve stress differences produced by different encapsulants and provides guidelines for selecting appropriate sample sizes. |
| doi_str_mv | 10.1109/ECTC.1995.514399 |
| format | conference_proceeding |
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In our experiment, two groups of parts, each with about 70 samples, were encapsulated with two different materials, one a standard and one a low stress formulation. Results are presented for the measured stress components; /spl sigma//sub xx/-/spl sigma//sub zz/, /spl sigma//sub xy/, and /spl sigma//sub xx/-/spl sigma//sub yy/. We observe an /spl ap/20% reduction in the compressive stress between the normal stress and low stress materials, and a small but measurable difference in the average in-plane shearing stress. This experiment demonstrates the ability to resolve stress differences produced by different encapsulants and provides guidelines for selecting appropriate sample sizes.</description><identifier>ISBN: 9780780327368</identifier><identifier>ISBN: 0780327365</identifier><identifier>DOI: 10.1109/ECTC.1995.514399</identifier><language>eng</language><publisher>IEEE</publisher><subject>Assembly ; Ceramics ; Compressive stress ; Encapsulation ; Mechanical variables measurement ; Piezoresistance ; Semiconductor device measurement ; Shearing ; Stress measurement ; Testing</subject><ispartof>1995 Proceedings. 45th Electronic Components and Technology Conference, 1995, p.300-304</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/514399$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/514399$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Sweet, J.N.</creatorcontrib><creatorcontrib>Peterson, D.W.</creatorcontrib><creatorcontrib>Emerson, J.A.</creatorcontrib><creatorcontrib>Mitchell, R.T.</creatorcontrib><title>Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip</title><title>1995 Proceedings. 45th Electronic Components and Technology Conference</title><addtitle>ECTC</addtitle><description>We have examined the use of the ATCO4 piezoresistive Assembly Test Chip to measure the mechanical surface stresses produced by liquid encapsulation of die mounted directly on ceramic substrates. In our experiment, two groups of parts, each with about 70 samples, were encapsulated with two different materials, one a standard and one a low stress formulation. Results are presented for the measured stress components; /spl sigma//sub xx/-/spl sigma//sub zz/, /spl sigma//sub xy/, and /spl sigma//sub xx/-/spl sigma//sub yy/. We observe an /spl ap/20% reduction in the compressive stress between the normal stress and low stress materials, and a small but measurable difference in the average in-plane shearing stress. This experiment demonstrates the ability to resolve stress differences produced by different encapsulants and provides guidelines for selecting appropriate sample sizes.</description><subject>Assembly</subject><subject>Ceramics</subject><subject>Compressive stress</subject><subject>Encapsulation</subject><subject>Mechanical variables measurement</subject><subject>Piezoresistance</subject><subject>Semiconductor device measurement</subject><subject>Shearing</subject><subject>Stress measurement</subject><subject>Testing</subject><isbn>9780780327368</isbn><isbn>0780327365</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1995</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNp9jsEKgkAURQciKMp9tHo_kM00ms4yxGgRBOFeJn3hhJrNG4v-PqHWXQ6cxdlcxhaC-0JwtU6TLPGFUqEfikAqNWKeimI-IDeR3MYT5hHd-LAgDGXAp-x8NI_elIBtoTvqa906IGeRCJ7aGu3MvSXQBA1q6i2W8DKuAlch7LLkFAyJsLnUb3BIDorKdHM2vuqa0Pt5xpb7NEsOK4OIeWdNo-07_x6Uf-MHZik_hg</recordid><startdate>1995</startdate><enddate>1995</enddate><creator>Sweet, J.N.</creator><creator>Peterson, D.W.</creator><creator>Emerson, J.A.</creator><creator>Mitchell, R.T.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1995</creationdate><title>Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip</title><author>Sweet, J.N. ; Peterson, D.W. ; Emerson, J.A. ; Mitchell, R.T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_5143993</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1995</creationdate><topic>Assembly</topic><topic>Ceramics</topic><topic>Compressive stress</topic><topic>Encapsulation</topic><topic>Mechanical variables measurement</topic><topic>Piezoresistance</topic><topic>Semiconductor device measurement</topic><topic>Shearing</topic><topic>Stress measurement</topic><topic>Testing</topic><toplevel>online_resources</toplevel><creatorcontrib>Sweet, J.N.</creatorcontrib><creatorcontrib>Peterson, D.W.</creatorcontrib><creatorcontrib>Emerson, J.A.</creatorcontrib><creatorcontrib>Mitchell, R.T.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore (Online service)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sweet, J.N.</au><au>Peterson, D.W.</au><au>Emerson, J.A.</au><au>Mitchell, R.T.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip</atitle><btitle>1995 Proceedings. 45th Electronic Components and Technology Conference</btitle><stitle>ECTC</stitle><date>1995</date><risdate>1995</risdate><spage>300</spage><epage>304</epage><pages>300-304</pages><isbn>9780780327368</isbn><isbn>0780327365</isbn><abstract>We have examined the use of the ATCO4 piezoresistive Assembly Test Chip to measure the mechanical surface stresses produced by liquid encapsulation of die mounted directly on ceramic substrates. In our experiment, two groups of parts, each with about 70 samples, were encapsulated with two different materials, one a standard and one a low stress formulation. Results are presented for the measured stress components; /spl sigma//sub xx/-/spl sigma//sub zz/, /spl sigma//sub xy/, and /spl sigma//sub xx/-/spl sigma//sub yy/. We observe an /spl ap/20% reduction in the compressive stress between the normal stress and low stress materials, and a small but measurable difference in the average in-plane shearing stress. This experiment demonstrates the ability to resolve stress differences produced by different encapsulants and provides guidelines for selecting appropriate sample sizes.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.1995.514399</doi></addata></record> |
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| identifier | ISBN: 9780780327368 |
| ispartof | 1995 Proceedings. 45th Electronic Components and Technology Conference, 1995, p.300-304 |
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| language | eng |
| recordid | cdi_ieee_primary_514399 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly Ceramics Compressive stress Encapsulation Mechanical variables measurement Piezoresistance Semiconductor device measurement Shearing Stress measurement Testing |
| title | Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip |
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